Microchip with TDK logo and "CH101" etched onto its surface

CH101

Ultra-Low-Power Integrated MEMS Ultrasonic Time‑of‑Flight Range Sensor with Millimeter Accuracy

Chirp’s MEMS based ultrasonic technology leverages a Time‑of‑Flight (ToF) range sensor with a power-efficient digital signal processor (DSP) ASIC in a 3.5 × 3.5 mm package. The sensor handles a variety of ultrasonic signal-processing functions and algorithms, enabling customers flexible industrial design options for a broad range of use-case scenarios, including range-finding, presence and proximity sensing, object-detection and avoidance, and position-tracking.

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Features

  • Ultra-Low Power
  • Works in Any Lighting Condition
  • Detects objects of any color and optical transparency
  • Customizable field of view (FoV) up to 180°
  • Integrated 3.5 × 3.5 × 1.26 mm Package
  • Low-power SoC firmware for ultrasonic processing a wide-range of usage cases

Product Features and Benefits

Field-of-View (FoV):
Configurable Up to 180°

Product key details

Operation
Pulse-Echo
Package Size
1.26 x 3.50 x 3.50
Range
Up to 1.2
Voltage
-
Current Consumption
15.00
Interface
I2C

Documentation and resources

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Datasheet / Product Brief

DS-000331 – CH101 Datasheet
Version1.4
Updated2020-12-23
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App Notes & User Guides

AN-000158 – CH101 and ICU-10201 Mechanical Integration Guide
Version1.2
Updated2021-10-06
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AN-000159 – CH101 and CH201 Ultrasonic Transceiver Handling and Assembly Guidelines
Version1.0
Updated2019-11-24
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AN-000169 – Ultrasonic Module Pulse-Echo Test Procedure
Version1.1
Updated2020-08-04
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AN-000259 – CH101 Design Guide
Version1.2
Updated2022-03-25
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Firmware Support

AN-000154 – SmartSonic “Hello Chirp” Application Hands-On Exercise
Version1.2
Updated2020-08-05
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AN-000175 – SonicLib Programmer's Guide
Version3.0
Updated2024-07-15
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AN-000156 – Chirp Microsystems CH101 SonicLink Software Quick Start Guide
Version1.1
Updated2019-09-27
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