CH201
Chirp’s MEMS based ultrasonic technology leverages a Time‑of‑Flight (ToF) range sensor with a power-efficient digital signal processor (DSP) ASIC in a 3.5 × 3.5 mm package. The sensor handles a variety of ultrasonic signal-processing functions and algorithms, enabling customers flexible industrial design options for a broad range of use-case scenarios, including range-finding, presence and proximity sensing, object-detection and avoidance, and position-tracking.
Features
- Detects objects of any color and optical transparency up to 5m
- Ultra-Low Power
- Works in Any Lighting Condition
- Customizable field of view (FoV) up to 180°
- Integrated 3.5 × 3.5 × 1.26 mm Package
- Low-power SoC firmware for ultrasonic processing a wide-range of usage cases
Product Features and Benefits
Field-of-View (FoV):
Configurable Up to 180°
Key features
Presence detection
Ultra-low power and low latency Ultrasonic ToF sensors detect presence and minor motion under any lighting condition
Obstacle avoidance
Always-on battery powered smart locks utilize ultra-low power Ultrasonic ToF sensors to enable feature rich smart locks
Gesture control
Ultra-low power sensing
Presence detection
Ultra-low power and low latency Ultrasonic ToF sensors detect presence and minor motion under any lighting condition
Obstacle avoidance
Always-on battery powered smart locks utilize ultra-low power Ultrasonic ToF sensors to enable feature rich smart locks
Gesture control
Ultra-low power sensing
Product details
Product key details
| Operation | ||
Pulse-Echo | - | - |
| Package Size | ||
1.26 x 3.50 x 3.50 | ||
| Range | ||
0 – 5 | - | - |
| Voltage | ||
- | - | - |
| Current Consumption | ||
13.50 | - | - |
| Interface | ||
I2C | - | SPI 13 MHZ |
Gaming
Mobile Devices & Computers
Industrial
Development hardware
EV_MOD_CH201-00-01
Ultrasonic ToF 45° FoV sensor module for rapid prototyping and integration into product enclosures
DK-CH201
Comprehensive development platform for CH201, with the ability to connect up to four additional CH201 modules.1212
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