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PositionSense 9-axis sensor solutions

Absolute position tracking with always-on calibration

Features and benefits

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TMR features

  • High sensitivity
  • High accuracy
  • Lowest-power magnetometer
  • Magnetic field shock-resistance
  • Low noise
  • Wide range

IMU features

  • Lowest power IMU technology
  • High-performance MEMS technology
  • Industry-first vibration-resistant gyro with Balanced Gyro technology
  • Low noise accelerometer

Software features

  • On-chip sensor fusion and precise time synchronization, for immediate processing of sensor data at exact moment of motion
  • Fast and accurate gyro and mag cross-calibration
  • Automatic magnetic shock recovery
  • PDR application-level software for a variety of operating systems and platforms

Product spotlight

Product spotlight - subtitle -CMS Data

Microchip with TDK logo and "ICM-45605" etched onto its surface

ICM-45605

High-Precision 6-Axis MEMS MotionTracking® Device

The ICM-45605 is an ultra high‑performance 6‑axis MEMS motion sensor family with the world’s first BalancedGyro™ technology and lowest power consumption. The sensor combines a 3‑axis gyroscope and a 3‑axis accelerometer in a compact 2.5 × 3 × 0.81 mm package.

Illustration of CH201, TDK MEMS ultrasonic time-of-flight sensor

CH201

Long-Range Ultra-Low-Power Integrated MEMS Ultrasonic Time‑of‑Flight Range Sensor with Millimeter Accuracy

Chirp’s MEMS based ultrasonic technology leverages a Time‑of‑Flight (ToF) range sensor with a power-efficient digital signal processor (DSP) ASIC in a 3.5 × 3.5 mm package. The sensor handles a variety of ultrasonic signal-processing functions and algorithms, enabling customers flexible industrial design options for a broad range of use-case scenarios, including range-finding, presence and proximity sensing, object-detection and avoidance, and position-tracking.

Development hardware

Development hardware - Subtitle

DK-CH201

DK-CH201

DK-CH201

Comprehensive development platform for CH201, with the ability to connect up to four additional CH201 modules.1212

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EV_MOD_CH201-00-01

Ultrasonic ToF

Ultrasonic ToF 45° FoV sensor module for rapid prototyping and integration into product enclosures

Illustration of CH201, TDK MEMS ultrasonic time-of-flight sensor

CH201

Long-Range Ultra-Low-Power Integrated MEMS Ultrasonic Time‑of‑Flight Range Sensor with Millimeter Accuracy

Chirp’s MEMS based ultrasonic technology leverages a Time‑of‑Flight (ToF) range sensor with a power-efficient digital signal processor (DSP) ASIC in a 3.5 × 3.5 mm package. The sensor handles a variety of ultrasonic signal-processing functions and algorithms, enabling customers flexible industrial design options for a broad range of use-case scenarios, including range-finding, presence and proximity sensing, object-detection and avoidance, and position-tracking.

MotionTracking™ Solutions with dedicated bundled software

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EV_MOD_CH201-00-01

Ultrasonic ToF 45° FoV sensor module for rapid prototyping and integration into product enclosures

DK-CH201

DK-CH201

Comprehensive development platform for CH201, with the ability to connect up to four additional CH201 modules.1212

Microchip with TDK logo and "ICM-45605" etched onto its surface

ICM-45605

The ICM-45605 is an ultra high‑performance 6‑axis MEMS motion sensor family with the world’s first BalancedGyro™ technology and lowest power consumption. The sensor combines a 3‑axis gyroscope and a 3‑axis accelerometer in a compact 2.5 × 3 × 0.81 mm package.

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